NTE2987
Logic Level MOSFET N-Channel, Enhancement Mode High Speed Switch

Features:
- Avalanche Rugged Technology
- Logic Level Gate Drive
- RDS(on) = 0.09Ω Typ. at VGS = 5V
- +175°C Operating Temperature
- Fast Switching
- Low Gate Charge
- High Current Capability

Info as pdf-file
NTE-ECG replacement list as pdf-file
NTE-ECG diagrams

Absolute Maximum Ratings:
Drain Current, ID
Continuous
TC = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20A
TC = +100°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14A
Pulsed (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80A
Total Power Dissipation (TC = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105W
Derate Above 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.7W/°C
Gate-Source Voltage, VGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±15V
Avalanche Current, Repetitive or Non-Repetitive (Note 2), IAR . . . . . . . . . . . . . . . . . . . . . . . . . . . 20A
Single Pulsed Avalanche Energy (Note 3), EAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120mJ
Repetitive Avalanche Energy (Note 2), EAR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mJ
Avalanche Current, Repetitive or Non-Repetitive (Note 4), IAR . . . . . . . . . . . . . . . . . . . . . . . . . . . 14A
Drain-Source Voltage (VGS = 0), VDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100V
Drain-Gate Voltage (RGS = 20kΩ), VDGR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100V
Operating Junction Temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65° to +175°C
Maximum Lead Temperature (During Soldering, 1.6mm from case, 10sec), TL . . . . . . . . . . +300°C
Thermal Resistance:
Maximum Junction-to-Case, RthJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.43°C/W
Typical Case-to-Sink (Mounting surface flat, smooth, and greased), RthCS . . . . . . 0.5°C/W
Maximum Junction-to-Ambient (Free Air Operation), RthJA . . . . . . . . . . . . . . . . . . . 62.5°C/W

Note 1. Pulse width limited by safe operating area.
Note 2. Pulse width limited by TJ max, Duty Cycle < 1%.
Note 3. VDD = 25V, ID = IAR, Starting TJ = +175°C.
Note 4. TC = +100°C, Pulse width limited by TJ max, Duty Cycle < 1%.


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