16.30CHF
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ab 100 13.30CHF

NTE2399 N-Channel MOSFET High Speed Switch TO-220

Bestell-Nr.:    NTE2399


Availability:     PICTURE_ONLY_FOUR
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NTE2399 NTE-2399 | ECG2399 ECG-2399 | NTE Electronics NTE2399
MOSFET N-Ch, Enhancement Mode High Speed Switch

Features:
- Dynamic dv/dt Rating
- Repetitive Avalanche Rated
- Fast Switching
- Ease of Paralleling
- Simple Drive Requirements

Info as pdf-file
NTE-ECG replacement list as pdf-file
NTE-ECG diagrams

Absolute Maximum Ratings:
Continuous Drain Current (VGS = 10V), ID
TC = +25°C................................................................ 3.1A
TC = +100°C................................................................ 2.0A
Pulsed Drain Current (Note 1), IDM...................................................12A
Power Dissipation (TC = +25°C), PD................................................ 125W
Derate Linearly Above 25°C...............................................1.0W/°C
Gate-to-Source Voltage, VGS.......................................................±20
Single Pulse Avalanche Energy (Note 2), EAS.......................................280mJ
Avalanche Current (Note 1), IAR.....................................................3.1A
Repetitive Avalanche Energy (Note 1), EAR.......................................... 13mJ
Peak Diode Recovery dv/dt (Note 3), dv/dt.........................................1.0V/ns
Operating Junction Temperature Range, TJ.................................. -55° to +150°C
Storage Temperature Range, Tstg.......................................... -55° to +150°C
Lead Temperature (During Soldering, 1.6mm from case for 10sec), TL.................+300°C
Mounting Torque (6-32 or M3 Screw).................................... 10 lbfin (1.1Nm)
Thermal Resistance, Junction-to-Case, RthJC.....................................1.0°C/W
Thermal Resistance, Junction-to-Ambient, RthJA...................................62°C/W
Typical Thermal Resistance, Case-to-Sink (Flat, Greased Surface), RthCS............ 0.5°C/W
Note 1. Repetitive rating; pulse width limited by maximum junction temperature.

Note 2. VDD = 50V, starting TJ = +25°C, L = 55mH, RG = 25Ω, IAS = 3.1A
Note 3. ISD ≤ 3.1A, di/dt ≤ 80A/μs, VDD ≤ 600V, TJ ≤ +150°C
Note 4. Pules Width ≤ 300μs, Duty Cycle ≤ 2%.


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