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NTE2383 P-Channel MOSFET High Speed Switch TO-220

Bestell-Nr.:    NTE2383


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NTE2383 NTE-2383 | ECG2383 ECG-2383 | NTE Electronics NTE2383
MOSFET P-Channel Enhancement Mode, High Speed Switch

(Compl to NTE2382)

Description:
The NTE2383 is a MOS power P-Channel FET in a TO220 type package designed for high voltage, high speed power switching applications such as switching regulators, converters, solenoid, and relay drivers.

Features:
- Lower RDS(ON)
- Improved Inductive Ruggedness
- Fast Switching Times
- Rugged Polysilicon Gate Cell Structure
- Lower Input Capacitance
- Extended Safe Operating Area
- Improved High Temperature Reliability

Info as pdf-file
NTE-ECG replacement list as pdf-file
NTE-ECG diagrams

Absolute Maximim Ratings:
Drain-Source Voltage (Note 1), VDSS................................................ 100V
Drain-Gate Voltage (RGS = 1MΩ, Note 1), VDGR...................................... 100V
Gate-Source Voltage, VGS.........................................................±20V
Continuous Drain Current, ID
TC = +25°C................................................................ 10.5A
TC = +100°C................................................................ 7.5A
Drain Current, Pulsed (Note 3), IDM...................................................42A
Gate Current, Pulsed, IGM.........................................................±1.5A
Single Pulsed Avalanvhe Energy (Note 4), EAS...................................... 510mJ
Avalanche Current, IAS............................................................ 10.5A
Total Power Dissipation (TC = +25°C), PD............................................ 75W
Derate Above 25°C.......................................................0.6W/°C
Operating Junction Temperature Range, Topr................................ -55° to +150°C
Storage Temperature Range, Tstg.......................................... -55° to +150°C
Thermal Resistance, Junction-to-Ambient, RthJA.................................. 62.5°C/W
Thermal Resistance, Junction-to-Case, RthJC.................................... 1.67°C/W
Thermal Resistance, Case-to-Sink (Note 5), RthCS.................................0.5°C/W
Maximum Lead Temperature (During Soldering, 1/8” from case, 5sec), TL.............. +300°C

Note 1. TJ = +25° to +150°C
Note 2. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
Note 3. Repetitive rating: Pulse width limited by max. junction temperature.
Note 4. L = 8.5mH, VDD = 25V, RG = 25Ω, Starting TJ = +25°C.
Note 5. Mounting surface flat, smooth, and greased.


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