25.10CHF
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NTE2394 N-Channel MOSFET High Speed Switch TO-3P

Bestell-Nr.:    NTE2394


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NTE2394 NTE-2394 | ECG2394 ECG-2394 | NTE Electronics NTE2394
MOSFET N-Channel Enhancement Mode, High Speed Switch

Description:
The NTE2394 is an N-Channel Enhancement Mode Power MOS Field Effect Transistor. Easy drive and very fast switching times make this device ideal for high speed switching applications. Typical applications include switching mode power supplies, uninterruptible power supplies, and motor speed control.

Features:
- High Voltage: 450V for Off-Line SMPS
- High Current: 12A for up to 350W SMPS
- Ultra Fast Switching for Operation at less than 100kHz

Industrial Applications:
- Switching Mode Power Supplies
- Motor Controls

Info as pdf-file
NTE-ECG replacement list as pdf-file
NTE-ECG diagrams

Absolute Maximum Ratings:
Drain-Source Voltage (VGS = 0, Note 1), VDS.........................................500V
Drain-Gate Voltage (RGS = 20kΩ, Note 1), VDGR...................................... 500V
Gate-Source Voltage, VGS.........................................................±20V
Pulsed Drain Current (Note 2), IDM...................................................56A
Clamped Drain Inductive Current (L = 100μH), IDLM.....................................56A
Continuous Drain Current, ID
TC = +25°C.................................................................. 14A
TC = +100°C................................................................ 8.8A
Total Dissipation (TC = +25°C), Ptot.................................................180W
Derate Above 25°C...................................................... 1.44W/°C
Maximum Operating Junction Temperature, TJ...................................... +150°C
Storage Temperature Range, Tstg.......................................... -55° to +150°C

Note 1. TJ = +25° to +125°C
Note 2. Repetitive Rating: Pulse width limited by maximum junction temperature.

Thermal Data:
Maximum Thermal Resistance, Junction-to-Case, RthJC...........................0.69°C/W
Typical Thermal Resistance, Case-to-Sink, RthCS.................................. 0.1°C/W
Maximum Thermal Resistance, Junction-to-Ambient, RthJA.........................30°C/W
Maximum Lead Temperature (During Soldering), TL.................................+300°C


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