NTE2381 NTE-2381 | ECG2381 ECG-2381 | NTE Electronics
NTE2381 (P-Ch)
Complementary Silicon Gate MOSFETs
Enhancement Mode, High Speed Switch
See also >>> NTE2380 (N-Ch)
Description:
The NTE2380 (N-Ch) and NTE2381 (P-Ch) are complementary TMOS power FETs in a TO220 type
package designed for high voltage, high speed power switching applications such as switching regulators,
converters, solenoid, and relay drivers.
Features:
- Silicon Gate for Fast Switching Speeds
- Rugged - SOA is Power Dissipation Limited
- Source-to-Drain Diode Characterized for Use With Inductive Loads
Info as pdf-file
NTE-ECG replacement list as pdf-file
NTE-ECG diagrams
Absolute Maximim Ratings:
Drain-Source Voltage, VDSS........................................................ 500V
Drain-Gate Voltage (RGS = 1MΩ), VDGR.............................................500V
Gate-Source Voltage, VGS.........................................................±20V
Drain Current, ID
Continuous
NTE2380................................................................ 2.5A
NTE2381................................................................ 2.0A
Pulsed
NTE2380.................................................................10A
NTE2381.................................................................. 8A
Total Power Dissipation (TC = +25°C), PD
NTE2380...................................................................40W
Derate Above 25°C...................................................0.32W/°C
NTE2381...................................................................75W
Derate Above 25°C.................................................... 0.6W/°C
Operating Temperature Range, Topr
NTE2380.......................................................... -55° to +150°C
NTE2381.......................................................... -65° to +150°C
Storage Temperature Range, Tstg
NTE2380.......................................................... -55° to +150°C
NTE2381.......................................................... -65° to +150°C
Thermal Resistance, Junction-to-Ambient, RthJA.................................. 62.5°C/W
Thermal Resistance, Junction-to-Case, RthJC
NTE2380...............................................................3.12°C/W
NTE2381...............................................................1.67°C/W
Maximum Lead Temperature (During Soldering, 1/8” from case, 5sec), TL
NTE2380.................................................................+300°C
NTE2381.................................................................+275°C
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