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Thermally Conductive Film for Semiconductor Enclosures TO-220

Bestell-Nr.:    FKY.WLU220


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Thermally Conductive Film for Semiconductor Enclosures TO-220

Dimensions: h=18mm w=13mm t=0.4mm

For more Assembly Material for Heatsinks
Heat Sinks (our whole assortment)
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Pictures are a guide only actual product may vary. Subject to alterations and errors.
Help us to eliminate errors: Please report any errors here. heat paste, thermal compound, thermal grease, thermal gel, heat sink compound, thermal interface material, (thermal) heatsink paste, CPU grease Wärmeleitpaste Wärmeleitpasten Waermeleitpaste Waermeleitpasten Waermeleit Wärmeleit Paste Pasten Wärmeleitprodukt Wärmeleitprodukte Wärmeleit Waermeleit Produkt Produkte Waermeleitprodukt Waermeleitprodukte Wärmeleitfilm Waermeleitfilm Heat Sink Compound
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